| 摘要 |
PURPOSE: A power amplifier module and a manufacturing method thereof are provided to prevent the permeation of external moisture due to fine-cracks by protecting completely a PSR(Photoimageable Solder Resister) layer from the exposure to the outside using a mold part attached locally to a module board along a stepped portion. CONSTITUTION: A power amplifier module includes a module board(10) with a pattern circuit(11) and a PSR layer(13) for protecting the pattern circuit, an IC(Integrated Circuit) chip(20) connected with the pattern circuit through wires(25) on the module board, passive elements(29) on the module board, and a mold part(30) for protecting the IC chip and passive elements. The mold part locally contact the module board along a stepped portion(40) of each edge of the module board. |
