发明名称 |
Low shrinkage thermosetting resin compositions and methods of use therefor |
摘要 |
In accordance with the present invention, there are provided thermosetting resin compositions with a reduced propensity to shrink in volume upon cure and methods of use therefor. The compositions of the present invention include compounds having aromatic, rigid-rod like spacer groups between the crosslinkable moieties. As such, these compounds impart a degree of liquid crystal-like character to the thermosetting resin composition which results in lower shrinkage upon cure. This effect follows from the well-known expansion that occurs when liquid crystal-like materials pass from a nematic liquid crystal-like state to an isotropic state. Further provided by the present invention are low shrinkage die attach pastes and methods of use therefor.
|
申请公布号 |
US6963001(B2) |
申请公布日期 |
2005.11.08 |
申请号 |
US20030367360 |
申请日期 |
2003.02.14 |
申请人 |
HENKEL CORPORATION |
发明人 |
DERSHEM STEPHEN M.;YANG KANG;LIU PUWEI |
分类号 |
C07C69/54;C07C69/753;C07D207/40;C07D207/404;C08F220/30;(IPC1-7):C07D209/56;C07D207/12;C08K2/46;C08J9/00;C07F126/08 |
主分类号 |
C07C69/54 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|