发明名称 Multilayer printed board with a double plane spiral interconnection structure
摘要 An inductor device having plural spiral-shaped interconnection structures connected to each other and extending in plural power source layers, the power source layers being in different levels of a multilayer printed board. The printed board having first and second current loops. The loops share part of a common current path.
申请公布号 US6963034(B2) 申请公布日期 2005.11.08
申请号 US20020093482 申请日期 2002.03.11
申请人 NEC CORPORATION 发明人 IWANAMI MIZUKI
分类号 H05K1/02;H01F17/00;H05K1/00;H05K1/16;H05K3/46;(IPC1-7):H05K1/16 主分类号 H05K1/02
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