发明名称 Exposure positioning in photolithography
摘要 A reticle for use in a photolithography process for exposing a photoresist layer in the production of a component which is formed from a plurality of adjacent exposed areas. The reticle includes an exposure aperture adapted to allow light to pass through the reticle, a patterned area within the exposure aperture which defines at least part of the functional design of the component, and one or more "stitching" structures located close to one or more of the edges of the exposure aperture. The "stitching" structures are arranged to create "stitching" marks on the photoresist, which can be used to determine whether the adjacent exposed areas have been accurately positioned.
申请公布号 US6962762(B2) 申请公布日期 2005.11.08
申请号 US20020318470 申请日期 2002.12.13
申请人 ZARLINK SEMICONDUCTOR LIMITED 发明人 MARTIN BRIAN;DANIELS IAN
分类号 G03F1/00;G03F1/14;G03F7/20;(IPC1-7):G03F9/00 主分类号 G03F1/00
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