| 摘要 |
PROBLEM TO BE SOLVED: To provide a silicon wafer manufacturing method capable of easily and inexpensively manufacturing a high-quality silicon wafer for restraining the occurrence of a particle and a slip. SOLUTION: This method manufactures the silicon wafer by performing at least slicing, chamfering, flattening and surface polishing. The silicon wafer manufacturing method removes processing strain caused by mechanical grinding by applying buff polishing without performing the etching of an edge part after grinding, by shaving off the corner of the edge part of the silicon wafer after slicing by the mechanical grinding using a resin bonded grinding wheel of grain sizes 1,500 to 6,000 as a chamfering process. COPYRIGHT: (C)2006,JPO&NCIPI
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