| 摘要 |
<P>PROBLEM TO BE SOLVED: To realize a flexible double-sided printed circuit board for surely performing second wire bonding with improved reproducibility in the flexible double-sided circuit board for mounting a semiconductor bare chip. <P>SOLUTION: In the flexible double-sided printed circuit board 3, in which a circuit pattern 2b made of a metal conductor, is formed on both the sides and the side of an insulator 1, the circuit pattern 2b is formed near a location including a position opposite to a position in which second wire bonding is made, while holding the insulator 1 in the flexible double-sided printed circuit board 3. As a result, load applied by a capillary 7 and ultrasonic vibration are propagated efficiently to a bonding wire 8 in the second wire bonding, and the circuit pattern 2b and the bonding wire 8 are surely jointed with improved reproducibility. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
