| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device sealed by one-shot molding, wherein wires at the center of the semiconductor chip and on the side opposite to the gate are prevented from short-circuiting, and to provide a method for manufacturing the same. <P>SOLUTION: At the center of the semiconductor chip 2 mounted on a wiring board 1, higher loops 9 and lower loops 10 are formed different from each other in height, and they are arranged alternately so that steps are provided between them. Owing to the steps thus provided, short-circuiting is prevented from occurring between neighboring wires even in the presence of drifting of wires due to a resin flow 8 during the one-shot molding process. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
