发明名称 |
HEAT RADIATING PLATE MADE OF SILICON CARBIDE |
摘要 |
PROBLEM TO BE SOLVED: To provide a heat radiating plate with an excellent heat conductivity which can be suitably used as a substrate for modules for loading a semiconductor device having a higher releasing value. SOLUTION: In the heat radiating plate made of silicon carbide obtained by processing silicon carbide monocrystal or silicon carbide polycrystal produced by a sublimation recrystallization method, the heat conductivity of the heat radiating plate at an ordinary temperature is 200 to 550 W/mK. COPYRIGHT: (C)2006,JPO&NCIPI |
申请公布号 |
JP2005311261(A) |
申请公布日期 |
2005.11.04 |
申请号 |
JP20040130053 |
申请日期 |
2004.04.26 |
申请人 |
NIPPON STEEL CORP |
发明人 |
KATSUNO MASAKAZU;TSUGE HIROSHI;YASHIRO HIROKATSU;OTANI NOBORU |
分类号 |
C30B29/36;H01L23/373;(IPC1-7):H01L23/373 |
主分类号 |
C30B29/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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