发明名称 HEAT RADIATING PLATE MADE OF SILICON CARBIDE
摘要 PROBLEM TO BE SOLVED: To provide a heat radiating plate with an excellent heat conductivity which can be suitably used as a substrate for modules for loading a semiconductor device having a higher releasing value. SOLUTION: In the heat radiating plate made of silicon carbide obtained by processing silicon carbide monocrystal or silicon carbide polycrystal produced by a sublimation recrystallization method, the heat conductivity of the heat radiating plate at an ordinary temperature is 200 to 550 W/mK. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005311261(A) 申请公布日期 2005.11.04
申请号 JP20040130053 申请日期 2004.04.26
申请人 NIPPON STEEL CORP 发明人 KATSUNO MASAKAZU;TSUGE HIROSHI;YASHIRO HIROKATSU;OTANI NOBORU
分类号 C30B29/36;H01L23/373;(IPC1-7):H01L23/373 主分类号 C30B29/36
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