发明名称 CERAMIC COMPOSITION AND CERAMIC WIRING BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a wiring board which is high in coefficient of linear expansion and low in dielectric loss, permits high-frequency transmission and is high in reliability of joining to a mother board. <P>SOLUTION: The ceramic composition containing Sr<SB>2</SB>SiO<SB>4</SB>crystal as main crystal is obtained by molding a ceramic raw material, or its calcined powder, of a composition containing 0.5 to 3 pts.wt. boron component in terms of an oxide per 100 pts.wt. principal component composed of 18 to 28 parts by weight SiO<SB>2</SB>and 72 to 82 parts by weight SrO. The composition is high in the coefficient of linear expansion and low in the dielectric loss and therefore the high-frequency transmission is made possible by using the composition and the ceramic wiring board having the high reliability to the joinability to the mother board can be obtained. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005306703(A) 申请公布日期 2005.11.04
申请号 JP20040130029 申请日期 2004.04.26
申请人 TAIYO YUDEN CO LTD 发明人 KATAOKA NORIHISA;KAWAMURA KEIZO;WAKAWA AKITOSHI
分类号 C04B35/16;H01L23/15;H05K1/03 主分类号 C04B35/16
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