| 摘要 |
PROBLEM TO BE SOLVED: To provide sucking equipment wherein simplification of equipment can be attained and poor lifting of a masking tape stuck on a plate type member like a wafer can be eliminated. SOLUTION: A wafer W is supported with a ring frame R through a dicing tape T from a rear face side, and a masking tape H is stuck on a surface side. The sucking equipment 12 is provided with a table 16 which is equipped with a sucking surface 15 on an upper surface. The sucking surface 15 performs predetermined sucking, sucks the dicing tape T, and holds the wafer W. A trench 24 is formed on at least a part of region along periphery of the sucking surface 15. By performing sucking with the sucking surface 15, the inside of the trench 24 serves as negative pressure, and the dicing tape T is collapsed. COPYRIGHT: (C)2006,JPO&NCIPI |
