| 摘要 |
PROBLEM TO BE SOLVED: To improve the uniformity of the thickness and characteristics of a deposited film by vacuum treatment. SOLUTION: A film-depositing apparatus 110 has a cylindrical reaction vessel 111; an exhausting means for decompressing the inside of the cylindrical reaction vessel 111; a substrate holder 117 for holding a cylindrical substrate 112 so that the axis of the cylindrical substrate 112 can have the same direction as a longitudinal direction of the cylindrical reaction vessel 111; a rotationally supporting mechanism 105 for rotating the substrate holder 117; a source gas introduction means for introducing a source gas into the cylindrical reaction vessel 111; a heating means for heating the substrate; and an application means for applying discharge energy. The above exhausting means has a plurality of exhaust ports 126 arrayed on a side wall of the cylindrical reaction vessel 111 in the longitudinal direction, exhaust pipes 128 connected to each of a plurality of the exhaust ports 126, and conductance valves 124A to 124C installed in each of the exhaust pipes 128. COPYRIGHT: (C)2006,JPO&NCIPI
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