| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a resin composition for heat-radiating material, excellent in thermal conductivity, flexibility and moldability. <P>SOLUTION: This acrylic sol composition for heat-radiating material is obtained by compounding (meth)acrylic polymer microparticles, a plasticizer and a filler. In this composition, the filler essentially comprises an inorganic filler ≥20 W/m×K in thermal conductivity, and it is preferable that the amount of the filler is 100-1,000 pts.mass based on the total of 100 pts.mass of the (meth)acrylic polymer microparticles and the plasticizer. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
