COOLING APPARATUS FOR HEAT-GENERATING DEVICES

摘要

PROBLEM TO BE SOLVED: To provide cooling devices for heat-generating devices such as semiconductor chips. SOLUTION: A cooling apparatus for heat-generating devices, such as semiconductor chips includes a parallel disk fan in the center portion of a set of heat sink fins. The parallel disk fan has radial elements, placed in between the disks to efficiently create air flow without turbulence. Cooling efficiency is further enhanced, when heat dissipation through the parallel disks of the fan is introduced. COPYRIGHT: (C)2006,JPO&NCIPI