Wärmeaktivierbare Adhäsivzusammensetzung und Adhäsivbogen mit Adhäsivschicht davon

摘要

A heat activatable adhesive composition including a thermoplastic resin, and a hindered phenol compound which is solid at 20 DEG C and which is fusible at an elevated temperature. The adhesive composition is useful as a heat activatable adhesive layer of labels or sheets including a heat-sensitive recording label.