Ceramics heater for semiconductor production system

摘要

For semiconductor manufacturing equipment a ceramic susceptor is made available in which by optimizing the inter-wiring-line separation in the resistive heating element, damage due to shorting between resistive heating element lines during heating operations is prevented while wafer-surface temperature uniformity is maintained. The ceramic susceptor ( 1 ) for semiconductor manufacturing equipment has a resistive heating element ( 3 a) on a surface of or inside ceramic substrate ( 2 ), with the smallest angle theta formed by the bottom and lateral sides of the resistive heating element ( 3 a) In a section of the resistive heating element ( 3 a) being 5° or greater. A plasma electrode may be arranged on a surface of or inside the ceramic substrates ( 2 a) of the ceramic susceptor ( 1 ). The ceramic substrates ( 2 a) are preferably made of at least one selected from aluminum nitride, silicon nitride, aluminum oxynitride, and silicon carbide.