CIRCUIT MATERIALS, CIRCUITS, MULTI-LAYER CIRCUITS, AND METHODS OF MANUFACTURE THEREOF
摘要
An electrical circuit material having a conductive layer disposed a substrate, wherein the substrate comprises an organic or inorganic polymer comprising a covelently bound polyhedral silsesquioxane (POSS). The substrate may further comprise an additional dispersed POSS, any other fillers including fibrous webs. Use of covelently bound POSS allow for flame retardancy in compositions having acceptable dielectric constants and dissipation factors.
申请公布号
WO2005072031(A3)
申请公布日期
2005.11.03
申请号
WO2005US03118
申请日期
2005.01.19
申请人
WORLD PROPERTIES, INC.;SETHUMADHAVAN, MURALI;LANDI, VINCENT, R.;BORGES, LUIS, D.
发明人
SETHUMADHAVAN, MURALI;LANDI, VINCENT, R.;BORGES, LUIS, D.