| 摘要 |
A LED light source module packaged with metal case comprises a plurality of LEDs mounted on a metallic circuit board. The metallic circuit board is comprised of a metal substrate and a wiring layer disposed on the upper surface of the metal substrate. The pins of the LEDs are directly bonded to the wiring layer of the metallic circuit board, and a power supply is connected to the wiring layer by two power wires. The metallic circuit board and the connection points of the pins and the power wires are encapsulated by a water-proof insulating adhesive layer. A heat-radiation plate is surface-mounted on the metal substrate such that heat can be conducted to the plate by the metallic circuit board, and then dissipated outside by the plate, therefore the module can have excellent heat-dissipation effects. On the other hand, the whole metallic circuit board and the connection points of the pins and the power wires are all protected by the water-proof insulating adhesive layer, thus the module can also have good water-proof capabilities. |
