| 摘要 |
<p>A method for increasing the manufacturing yield for a vertically integrated device is disclosed. The devices are composed of one or more multiple layer die. The number of functioning layers of each multiple layer die is determined diagnostically. Each of said multiple layer die are sorted based on said number of functioning layers. Also disclosed are methods for combining sorted die, and methods for slicing sorted die, to form die with a desired number of known good layers.</p> |
