发明名称 PULSED LASER PROCESSING WITH CONTROLLED THERMAL AND PHYSICAL ALTERATIONS
摘要 Laser machining of material using a burst of ultrashort laser pulses, tailoring the pulse width, pulse separation duration, wavelength, and polarization to maximize the positive effect of thermal and physical changes achieved by the previous pulse on the laser-matter interaction. Manipulations of pulse width, pulse separation duration, and pulse energies of pulses within a burst can be used to achieve better processing results. Wavelength and polarization of a laser beam may be varied pulse-to-pulse in a burst in order to produce maximum laser-matter interaction.
申请公布号 WO2005099957(A2) 申请公布日期 2005.10.27
申请号 WO2005US08623 申请日期 2005.03.14
申请人 IMRA AMERICA, INC.;YAMAMOTO, TADASHI;HARTER, DONALD, J.;PATEL, RAJESH, S.;ARAI, ALAN, Y. 发明人 YAMAMOTO, TADASHI;HARTER, DONALD, J.;PATEL, RAJESH, S.;ARAI, ALAN, Y.
分类号 B23K26/00;B23K26/06 主分类号 B23K26/00
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