| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an aligner capable of excellently forming a reticle image on a wafer surface, even in case of immersion type for example, by performing highly precise focusing, an exposure method, and a device manufacturing method using the exposure method. <P>SOLUTION: The aligner is applied to illuminating a reticle using exposing light, and to projective exposing of the pattern on a reticle to a substrate via a projection optical system. In order to correct the focusing position of the substrate to a reticle, a reticle driver is provided so that the reticle can be moved in at least one some direction out of an optical axial direction or the directions inclining to the optical axial direction. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
