| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a package for electronic components having such a structure that hardly damages a cover for sealing a main body package by reducing the horizontal dimension as much as possible, and to provide a piezoelectric device using the same, and to provide its manufacturing method, etc. <P>SOLUTION: The package for electronic components comprises the main body package 17 formed of an insulating material which has an internal space S2 for storing an electronic component and is opened upward, and the cover 19 for closing the opening of the main body package. The main body package has nearly a rectangular shape. The opposite longer sides of the main body package located in the peripheral edge of the opening have a dimension larger than that of the outer shape of the cover. In portions of the opposite longer sides outside the cover, there are protections 91 and 91 projecting in the height direction. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
