| 摘要 |
PROBLEM TO BE SOLVED: To obtain the shield structure of an electronic component wherein a shield configuration is enabled by using a simple constitution of low cost without increasing a board area in a circuit board configuration which uses a flexible board. SOLUTION: In the structure, a first flexible layer 1a on which an electronic component 2 is mounted, and a multilayer circuit board 1 having a second flexible layer 1b a part of which is laminated and bonded on the flexible layer 1a are installed. A shield means is formed on the surface of the second flexible layer 1b, the second flexible layer 1b is turned up by using the laminated bonding portion as a base point, and a predetermined portion containing the electronic component 2 is covered which becomes the shield object of the first flexible layer 1a. The first flexible layer 1a and the second flexible layer 1b are electrically connected. COPYRIGHT: (C)2006,JPO&NCIPI
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