ULTRASONIC FLIP-CHIP MOUNTING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a mounting method reliable ultrasonic bonding of a semiconductor chip by a flip-chip connecting method wherein the semiconductor chip is mounted after an underfil resin is supplied. SOLUTION: The ultrasonic flip-chip mounting method uses a mounting method by flip-chip connection of the semiconductor chip using ultrasonic bonding after supplying an underfil resin onto a substrate. As a semiconductor chip to be used for this method, such a chip is used that a side face is divided into two regions in the thickness direction and the circuit-formed surface-side region is formed into a rough surface 10a while the rear face-side region is formed into a mirror surface 10b. COPYRIGHT: (C)2006,JPO&NCIPI