| 摘要 |
PROBLEM TO BE SOLVED: To increase the reliability by improving the connectivity between the metal projection of a semiconductor element and the electrode of an interposer substrate even if the interposer substrate has warpage produced during the manufacturing process. SOLUTION: This semiconductor device comprises a semiconductor carrier having a group of wiring patterns on one surface and a group of external terminals on the other surface, the semiconductor element having electrodes connected to the group of wiring patterns of the semiconductor carrier by a conductive adhesive, and a resin which fills up a space between the semiconductor element and the semiconductor carrier and covers the peripheral edge of the semiconductor element. Out of the electrodes 54 of the semiconductor element 55, at least one of them comprises the metal projection 15 having a loop-like metal line 51a. Since the metal projection 15 is linearly enlarged and has a flexibility even if the interposer substrate of the semiconductor carrier has warpage, the metal projection 15 absorbs the warpage during connection as well as absorbing a gap between the semiconductor element and the interposer substrate due to thermal expansion and contraction, leading to an increase in reliability. COPYRIGHT: (C)2006,JPO&NCIPI
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