发明名称 structure and method of manufacturing a finFet device having stacked fins
摘要 The present invention provides a device structure and method of forming a finFet device having stacked fins. The method of the present invention comprises: providing a substrate with a first semiconductor layer on a first insulator layer, a second insulator layer on the first semiconductor layer, and a second semiconductor layer on the second insulator layer; forming a first fin and a second fin in the second semiconductor layer; masking the first fin; and forming a third fin in the first semiconductor layer, where the second fin is stacked on the third fin. The structure of the present invention comprises: a semiconductor substrate having a first semiconductor layer on a first insulator layer, a second insulator layer on the first semiconductor layer, and a second semiconductor layer on the second insulator layer; a first and second fin formed in the second semiconductor layer; and a third fin formed in the first semiconductor layer, where the second fin is stacked on the third fin.
申请公布号 US2005239242(A1) 申请公布日期 2005.10.27
申请号 US20040709248 申请日期 2004.04.23
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 ZHU HUILONG;DORIS BRUCE B.
分类号 H01L21/336;H01L21/8238;H01L21/84;H01L27/12;H01L29/786;(IPC1-7):H01L21/823 主分类号 H01L21/336
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