THERMOSETTING RESIN COMPOSITION, LAMINATED BODY USING IT, AND CIRCUIT BOARD

摘要

A thermosetting resin composition, a laminated body using it and a circuit board, which have excellent adhesiveness, processability and heat resistance, and furthermore, excellent dielectric characteristics in a GHz band. The thermosetting resin composition includes (A) an imide oligomer component including at least one type of imide oligomer having a specific structure, and (B) an epoxy resin component including at least one type of epoxy resin. Furthermore, the thermosetting resin composition includes (C) a polyimide resin component.