| 摘要 |
PROBLEM TO BE SOLVED: To realize a thin and downsized semiconductor module. SOLUTION: The semiconductor module comprises a module substrate having wirings on its upper surface and external-electrode terminals on its lower surface, not less than two dents provided on the upper surface of the module substrate and having wirings of the predetermined pattern on its bottom face, a semiconductor chip mounted on the bottom of the one dent by the flip chip bonding, an integrated passive device mounted on the bottom of the other dent by the flip chip bonding, a discrete component mounted on the upper surface of the module substrate; and a sealing body comprising an insulating resin provided on the whole upper surface of the module substrate and covering the semiconductor chip, the integrated passive device, and the discrete component. The plurality of semiconductor chips forming transistors are mounted on the module substrate and a multistage amplifier is formed by these transistors. An output matching circuit of an output stage transistor of the multistage amplifier is formed by the integrated passive device. COPYRIGHT: (C)2006,JPO&NCIPI |
