发明名称 BINDER RESIN FOR CONDUCTIVE PASTE, AND CONDUCTIVE PASTE
摘要 PROBLEM TO BE SOLVED: To provide a binder resin for a conductive paste having excellent adhesiveness to a ceramic green sheet, free from the generation of delamination trouble and exhibiting excellent thermal decomposition property and screen printability and provide a conductive paste. SOLUTION: The binder resin for a conductive paste contains a modified polyvinyl acetal resin composed of structural units expressed by general formulas (1), (2), (3) and (4) shown in the figure. In the formulas, R<SP>1</SP>is a 1-20C straight or branched chain alkyl; R<SP>2</SP>is H or a 1-20C straight-chain, branched chain or cyclic alkyl or an aryl group; and n is an integer of 1-8. The content of the structure unit expressed by general formula (3) in the modified polyvinyl acetal resin is 1-20 mol% and the content of the structure unit expressed by general formula (4) is 30-78 mol%. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005298792(A) 申请公布日期 2005.10.27
申请号 JP20040190354 申请日期 2004.06.28
申请人 SEKISUI CHEM CO LTD 发明人 TAKAHASHI HIDEYUKI;II DAIZO;ICHITANI MOTOKUNI;OCHITANI YUKIO;SAKASHITA KATSUAKI
分类号 C08K3/00;C08F216/38;C08K5/00;C08L29/14;H01B1/22;H01G4/12;H01G4/30;(IPC1-7):C08F216/38 主分类号 C08K3/00
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