Ready-for-dispatch package for semiconductor wafers, and method for the ready-for-dispatch packaging of semiconductor wafers

摘要

The invention relates to a ready-for-dispatch package for semiconductor wafers, comprising a) a closeable plastic container which is loaded with the semiconductor wafers and has a lid and a body, a seal between the lid and the body and a particle filter which is integrated with the container and allows exchange of gas between the interior space of the container and the external environment of the container; b) a first sheath made from plastic, which surrounds the container and rests closely against the container with the aid of reduced pressure; c) a means for binding moisture; d) a second sheath made from coated plastic, with a coating which blocks the passage of moisture and rests closely against the first sheath and against the container with the aid of reduced pressure; e) a shock-absorbing structure which embeds the sheathed container in a positive-fitting manner; and f) an outer packaging which surrounds the double-sheathed and embedded container in a positive-fitting manner. The invention also relates to a method for the ready-for-dispatch packaging of semiconductor wafers in a packaging of this type.