发明名称 |
Method for mounting semiconductor device, as well as circuit board, electrooptic device, and electronic device |
摘要 |
A method of forming a bonded structure comprises the steps of: mounting a semiconductor device having an electrode; a convexity protruding higher than the electrode and formed of a resin; and a conductive unit electrically coupled to the electrode and extending over the surface of the convexity, onto a specific substrate with an intermediary of a bonding material; and mounting the semiconductor device by hot pressing within a temperature range including the glass transition temperature of the resin. |
申请公布号 |
US2005236104(A1) |
申请公布日期 |
2005.10.27 |
申请号 |
US20050103942 |
申请日期 |
2005.04.12 |
申请人 |
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发明人 |
TANAKA SHUICHI |
分类号 |
H01L21/60;G09F9/00;H01L21/603;H01L23/485;(IPC1-7):B32B31/20 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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