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发明名称
PRINTED CIRCUIT BOARD FOR PACKAGING A SEMICONDUCTOR CHIP
摘要
申请公布号
KR20050102497(A)
申请公布日期
2005.10.26
申请号
KR20040027902
申请日期
2004.04.22
申请人
HYNIX SEMICONDUCTOR INC.
发明人
SONG, TAE HEE
分类号
H05K1/02;(IPC1-7):H05K1/02
主分类号
H05K1/02
代理机构
代理人
主权项
地址
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