| 摘要 |
PROBLEM TO BE SOLVED: To provide a digital amplifier substrate wherein heat generated from an electronic component mounted on the digital amplifier substrate can be efficiently radiated, so that failure of the electronic component by heat can be prevented. SOLUTION: A heat dissipating plate 11 is constituted of metal material like brass which has high thermal conductivity and electric conductivity and arranged in contact with a heat generating component whose heat generating amount is large out of electronic components mounted on the digital amplifier substrate 10. A shielding case 12 is constituted of metal material like a steel plate having conductivity, forms a closed space by making the heat dissipating plate 11 as a part of the shielding case 12, and wraps the digital amplifier substrate 10 in the closed space. In the shielding case 12, a plurality of heat dissipation holes 13 for promoting convection of air to the wrapped digital amplifier substrate 10 are formed. COPYRIGHT: (C)2006,JPO&NCIPI
|
