| 摘要 |
A flip-chip package structure includes a flexible interconnection structure, at least one chip, a stiffener layer, and an isolating layer. The flexible interconnection structure having a plurality of bumps on a top surface, a plurality of contact terminals on a bottom surface, and an inner circuit connected to the bumps and the contact terminals. The chip and the stiffener layer are mounted on the top surface of the flexible interconnection structure, and the isolating layer is attached on the bottom surface. The isolating layer includes a plurality of openings that respectively expose the contact terminals of the flexible interconnection structure.
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