| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit substrate in which via-holes for reducing high-frequency noise higher in noise reducing effect are formed instead of a conventional high-frequency noise reducing method for forming slits on a ground pattern. SOLUTION: The circuit substrate is provided with at least a ground layer on which a ground pattern is formed, an insulating layer, a wiring layer on which a wiring pattern is formed. These elements are laminated sequentially, and a circuit component is arranged on the wiring layer. A ground part separated from the ground pattern is formed around the circuit component on the wiring layer differently from the wiring pattern, and via-holes conduct the ground part with the ground pattern through the insulating layer. COPYRIGHT: (C)2006,JPO&NCIPI |
