发明名称 LEAD-FREE SOLDER WELD
摘要 PROBLEM TO BE SOLVED: To provide a lead-free solder weld that inhibits generation of whiskers and that makes highly reliable soldering possible. SOLUTION: The lead-free solder weld is composed of lead-free solder containing 0.1-1.0 wt% Co in Sn or an Sn-based alloy containing no Pb. As a result, reaction between a member to be soldered and Sn or an Sn-based alloy is suppressed, and formation and growth of inter-metallic compounds in the joined boundary as well as increase in internal stress is suppressed, so that generation and growth of whiskers in the joined boundary can be inhibited. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005288478(A) 申请公布日期 2005.10.20
申请号 JP20040106865 申请日期 2004.03.31
申请人 TOSHIBA CORP 发明人 KURI YUUJI;TAN TORONRON;TANAKA AKIRA
分类号 B23K35/26;(IPC1-7):B23K35/26 主分类号 B23K35/26
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