| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high heat dissipation LED light emitting element in which a heat concentration at a high current lighting is improved and a light emitting efficiency is improved, and to provide a method of manufacturing the same. <P>SOLUTION: The high heat dissipation LED light emitting element is made of a transparent package resin and a heat dissipation package resin by forming the heat dissipation resin by mixing the heat dissipation powder and the package resin. In a layered heat dissipation package at the packaging, the upper layer light emitting region of the LED light emitting element does not affect the light emitting conditions of the LED light emitting element. The lower layer heat dissipation region performs a plurality of times of packages by the heat dissipation package resin. The heat energy generated when the LED chip is lighted is guided out of the heat dissipation package resin layer. The heat is not concentrated at the high current lighting. The light emitting efficiency is improved. The method of manufacturing is applied to the lead frame type LED light emitting element. At a mass production, it is not necessary to change the original manufacturing process and apparatus, but the heat dissipation effect of the light emitting element is improved by using the penetrating step of the heat dissipation package resin. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
