摘要 |
PROBLEM TO BE SOLVED: To provide a small-sized camera module in which the tilt of a housing (lens) with respect to a solid-state imaging element face is minimized. SOLUTION: The housing 11 is directly mounted on an upper side of a solid-state imaging element 2 mounted on a board 1 in a way of covering a light receiving region 2a of the solid-state imaging element 2. The solid-state imaging element 2 and electrodes 1a on the board 1 are connected to each other with wires 3 and a resin 10 protects the wires 3. This provision permits that not only an angular positional deviation between an optical axis of the lens and the solid-state imaging element face can be minimized more than the case with mount of the housing on the board, but also a large sized housing for covering the solid-state imaging element unlike prior arts is not required. COPYRIGHT: (C)2006,JPO&NCIPI
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