| 摘要 |
PROBLEM TO BE SOLVED: To provide roughening-treated rolled copper alloy foil in which craters as the remarkable defect characteristic of rolled copper alloy foil provided with a roughening-treated face are reduced, further to provide rolled copper alloy foil having high strength, adhesive strength with a resin layer, acid resistance, tinning liquid resistance and high peel strength, further provided with satisfactory etching properties and glossiness and suitable for a flexible printed circuit board capable of the fine-patterning of wiring, and to provide a roughening treatment method therefor. SOLUTION: The copper alloy foil provided with a roughening-treated face is characterized in that the number of craters present in the roughening-treated face of the rolled copper alloy foil subjected to roughening treatment with copper fine particles is≤10 pieces/25 mm<SP>2</SP>. The roughening treatment method for copper alloy foil is characterized in that roughening plating is performed under the conditions that: the content of copper sulfate is 3 to 50 g/L expressed in terms of Cu; the content of nickel sulfate is 1 to 50 g/L expressed in terms of Ni; the content of phosphoric acid is 0.75 to 1,000 g/L expressed in terms of P; the content of sulfuric acid is 1 to 150 g/L; temperature is 20 to 40°C; and Dk is 30 to 70 A/dm<SP>2</SP>. COPYRIGHT: (C)2006,JPO&NCIPI
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