POLISHING PAD

摘要

PROBLEM TO BE SOLVED: To provide a polishing pad where polishing slurry can efficiently be kept between the surface of the polishing layer of the polishing pad and a face to be polished such as a wafer, the face update processing of the polishing face is not required or necessity of the processing is remarkably reduced.

SOLUTION: The polishing pad has at least one type of holes or grooves on the surface and a rear face of the polishing layer. At least one type of the holes and the grooves on the surface of the polishing layer and at least one type of the holes and the grooves at the rear face are formed so that they are not mutually connected. The polishing pad has one or two or above concentric grooves on the surface and the rear face of the polishing layer of the polishing pad. The grooves on the surface of the polishing layer and the grooves on the rear face are formed so that they are not mutually connected.

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