| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a substrate with the purpose of lessening a hardness dispersion of a half-cured sheet, and a circuit board. SOLUTION: In this method for manufacturing the substrate, a sheet 1 formed of a kneaded material of fine powder of metallic oxide, a heat-curing resin and a pregel material, copper foils 5 and 7 appplied to both face and back of the sheet 1, a hotplate 10 for thermally pressurizing and half-curing the sheet 1 and the copper foils 5 and 7, a base board 11 and a spacer 12, are provided. In addition, the method equally stabilizes the sheet hardness of each layer and is characterized in that its productivity is high. COPYRIGHT: (C)2006,JPO&NCIPI |
