发明名称 |
REVERSIBLE LEADLESS PACKAGE AND METHODS OF MAKING AND USING SAME |
摘要 |
A semiconductor device package includes an electrically conductive lead frame having a plurality of posts disposed at a perimeter of the package. Each of the posts has a first contact surface disposed at the first package face and a second contact surface disposed at the second package face. The lead frame also includes a plurality of post extensions disposed at the second package face. Each of the post extensions includes a bond site formed on a surface of the post extension opposite the second package face. At least one I/O pads on the semiconductor device is electrically connected to the post extension at the bond site using wirebonding, tape automated bonding, or flip-chip methods. The package can be assembled use a lead frame having pre-formed leads, with or without taping, or it can employ the use of partially etched lead frames. A stack of the semiconductor device packages may be formed. |
申请公布号 |
WO2005022591(A3) |
申请公布日期 |
2005.10.20 |
申请号 |
WO2004US26790 |
申请日期 |
2004.08.18 |
申请人 |
ADVANCED INTERCONNECT TECHNOLOGIES LIMITED;ISLAM, SHAFIDUL;SAN ANTONIO, ROMARICO, SANTOS |
发明人 |
ISLAM, SHAFIDUL;SAN ANTONIO, ROMARICO, SANTOS |
分类号 |
H01L;H01L21/44;H01L21/48;H01L23/31;H01L23/495;H01L25/10 |
主分类号 |
H01L |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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