发明名称 |
Slotted substrate |
摘要 |
The described embodiments relate to a slotted substrate (308) for use in a fluid ejecting device. One exemplary embodiment includes a substrate (308) having a thickness between generally opposing first (310) and second (312) surfaces. A slot (505) is received in the substrate (308). The slot (505) has a central region (505a) joined with at least one terminal region (505b). The central region (503a) extends between the first (310) and second (312) surfaces. The at least one terminal region (505b) includes, at least in part, a bowl-shaped portion that has a diameter (d) at the first surface (310) greater than a width (w) of the central region (503a) at the first surface (310). <IMAGE> |
申请公布号 |
EP1386740(B1) |
申请公布日期 |
2005.10.19 |
申请号 |
EP20030254533 |
申请日期 |
2003.07.17 |
申请人 |
HEWLETT-PACKARD COMPANY |
发明人 |
BUSWELL, SHEN;BERGSTROM, DEANNA J.;FRECH, DANIEL |
分类号 |
B41J2/14;(IPC1-7):B41J2/14 |
主分类号 |
B41J2/14 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|