| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming a plating film on a substrate to be plated by continuously reducing the thickness of a diffusion layer, which is formed by applying current onto the surface of the substrate to be plated, to≤10μm and performing high current density electrolysis, and to provide an apparatus therefor. SOLUTION: The apparatus is equipped with a plating tank 2 filled with a plating solution, an anode 3 placed inside the plating tank 2, a hollow cylindrical member 4 which is fixed in a suspended manner in the plating tank 2, has several pores 13 formed on its wall and has an outlet duct 5 branched therefrom and a suction pump 34 installed onto the outlet duct 5. In the method, the plating solution in the hollow cylindrical member 4 is continuously discharged through the suction action of the suction pump 34 while the plating solution in the plating tank 2 is being compulsorily introduced into the hollow cylindrical member 4 via the several pores 13 to generate a turbulence in the hollow cylindrical member 4. The turbulence is retained while the current is being applied to continuously reduce the thickness of the diffusion layer formed on the surface of the substrate to be plated 15. COPYRIGHT: (C)2005,JPO&NCIPI |
