发明名称 Testing method for electronic component and testing device
摘要 A testing method for an electronic component in which a predetermined load is set, which is determined by a burn-in temperature, a burn-in voltage, and a burn-in period of time, and burn-in of an electronic component is carried out in such a manner that a load equal to the predetermined load is applied to the electronic component, with the method including a first step of placing an electronic component having a negative resistance-temperature characteristic in a heating atmosphere so that the temperature of the electronic component reaches a predetermined temperature which is lower than the burn-in temperature, a second step of supplying constant current to flow through the electronic component so that the predetermined temperature of the electronic component is increased to the burn-in temperature, and a third step of comparing the voltage actually applied to the electronic component to the burn-in voltage, correcting the burn-in time-period based on the comparison to determine a corrected burn-in time-period, and applying constant current to flow through the electronic component based on the corrected burn-in time-period.
申请公布号 US6956391(B2) 申请公布日期 2005.10.18
申请号 US20030669695 申请日期 2003.09.25
申请人 MURATA MANUFACTURING CO., LTD. 发明人 KAMITANI GAKU
分类号 G01R31/00;G01R31/01;(IPC1-7):G01R31/02;G01R31/26 主分类号 G01R31/00
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