发明名称 |
Multi-part lead frame with dissimilar materials |
摘要 |
A multi-part lead frame semiconductor device assembly is disclosed including a die bonded to a die paddle. A second lead frame including leads is superimposed and bonded onto the first lead frame. Also disclosed is a method for fabricating the multi-part lead frame semiconductor device assembly which utilizes equipment designed for single lead frame processing. If desired, the materials for the multi-part lead frame may be dissimilar.
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申请公布号 |
US2005224928(A1) |
申请公布日期 |
2005.10.13 |
申请号 |
US20050137034 |
申请日期 |
2005.05.25 |
申请人 |
HINKLE S D;BROOKS JERRY M;CORISIS DAVID J |
发明人 |
HINKLE S. D.;BROOKS JERRY M.;CORISIS DAVID J. |
分类号 |
H01L23/495;(IPC1-7):H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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