| 摘要 |
<p>Method for fabricating an interconnect on a substrate. The method includes applying a mask on the substrate, patterning the mask, so that it has an opening corresponding to the interconnect, providing the interconnect in the opening on the substrate, widening the opening in order to uncover a region laterally adjoining the interconnect, encapsulating of interconnect in the widened opening, andremoving the mask.</p> |
