| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition that is excellent in moldability and flowability, and whose cured product shows an elastic modulus whose decrease within a temperature range above its Tg is low, and to provide a semiconductor device using the same. SOLUTION: The epoxy resin composition comprises an epoxy resin (A), a curing agent (B), a compound represented by general formula (1), a compound represented by general formula (2) and a condensation product (C) as an essential component that comprises the compound represented by general formula (1) and the compound represented by general formula (2) with a ratio in a range of 100/0-20/80 and whose average polymerization grade is 2-50, wherein R<SB>1</SB>is a 1-6C lower alkyl or phenyl group and R<SB>2</SB>is a 1-4C lower alkyl group in the formula (1), and R<SB>3</SB>in formula (2) is a 1-4C lower alkyl group. COPYRIGHT: (C)2006,JPO&NCIPI
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