发明名称 Multi-passivation layer structure for organic thin-film transistors and method for fabricating the same
摘要 The present invention discloses a multi-passivation layer structure for organic thin-film transistors and a method for fabricating the same by spin coating, inject printing, screen printing and micro-contact on organic thin-film transistors. The multi-passivation layer structure for organic thin-film transistors, comprising: a substrate; a gate layer formed on the substrate; an insulator layer formed on the substrate and the gate layer; an electrode layer formed on the insulator layer; a semiconductor layer formed on the insulator layer and the electrode layer; and a passivation layer formed on the semiconductor layer and the electrode layer, thereby forming a multi-passivation layer structure for organic thin-film transistors.
申请公布号 US2005227407(A1) 申请公布日期 2005.10.13
申请号 US20040863212 申请日期 2004.06.09
申请人 INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE 发明人 HSIEH CHENG-CHUNG;HO JIA-CHONG;HU TARNG-SHIANG;LEE CHENG-CHUNG;HUANG LIANG-YING;LIN WEI-LING;HUANG WEN-KUEI
分类号 H01L29/786;H01L21/312;H01L21/336;H01L51/05;H01L51/10;H01L51/40;H01L51/52;(IPC1-7):H01L51/40 主分类号 H01L29/786
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