| 摘要 |
PROBLEM TO BE SOLVED: To improve the performance of the sealing resin of a flip chip type electronic component, and to miniaturize this flip flop type electronic component. SOLUTION: One main surface 16a of a sealing board 16 formed with sealing resin 14 in a semi-cured status is arranged so as to be faced to one main surface 10a of a substrate 10 mounted with a plurality of chips 12, and the plurality of chips 12 and sealing resin 14 are interposed between the substrate 10 and the sealing board 16 so that the sealing resin 14 can be made to flow between the respective chips 12, and that the resin sealing of those respective chips 12 can be carried out. After the sealing resin 14 cured, the substrate 10 and the sealing board 16 are integrated into pieces by the units of the chips 12 in such a status that the plurality of chips 12 and the sealing resin 14 are interposed between the substrate 10 and the sealing board 16. COPYRIGHT: (C)2006,JPO&NCIPI
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