| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that, when a semiconductor package or electronic element is press-bonded to a substrate, such as the wiring board etc., under a high-temperature and high-pressure condition, the decomposition or dissociation of the resin forming the substrate occurs or the deterioration of a metallic material by oxidation occurs. SOLUTION: A bonding device which press-bonds a press-bonding section can make the press-bonding under a low-temperature and low-pressure condition by making the moisture content in the press-bonding section atmosphere in the bonding device lower than that in the outside atmosphere of the device. In this case, the adsorbed moisture contents in the surfaces of a bonding metallic terminal and a bonded metallic terminal forming the press-bonding section are adjusted to≤1×10<SP>16</SP>molecules/cm<SP>2</SP>. COPYRIGHT: (C)2006,JPO&NCIPI
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